BYK S 750 N is a styrene emission suppressant additive that can be used in DCPD-containing unsaturated polyester resins and isophthalic and vinyl ester resins. BYK S 750 N reduces styrene emissions without negatively impacting the interlaminar adhesion properties of the resin. As a paste, BYK S 750 N must be thoroughly mixed into the resin formulation before other components are added. It works by forming a surface film on cured materials to control styrene release from the substrate. BYK S 750 N provides benefits for applications involving resins by controlling styrene emissions and maintaining adhesion between layers for high quality end products.